Issue №2, Vol. 13
Panov N., Pitukhin A., Kolesnikov G., Vasil S. MANUFACTURING TECHNOLOGY CHIPBOARD USING THE AMORPHOUS SILICON DIOXIDE // Resources and Technology. 2016. №2, Vol. 13. P. 34‒44.



DOI: 10.15393/j2.art.2016.3261

MANUFACTURING TECHNOLOGY CHIPBOARD USING THE AMORPHOUS SILICON DIOXIDE

Panov
   Nikolai 		Petrozavodsk State University, supernikola@yandex.ru
Pitukhin
   Alexander 		Petrozavodsk State University, pitukhin@petrsu.ru
Kolesnikov
   Gennady 		Petrozavodsk State University, kgn@petrsu.ru
Vasil
   Sergei 		Petrozavodsk State University, servas-10rus@ya.ru
Key words:
amorphous silica
adhesive composition
chipboard
toughness		 Summary: The article discussed the features of the use of amorphous silica with a nano porous structure as a modifier of adhesive compositions for chipboard. The purpose of this work: to study the influence modifier in the form of amorphous silica brand "Kovelos" 35/05 on the strength of the samples chipboard flexural and tensile perpendicular plasti boards. Experimentally determined, if the proportion of the additive increases from 0% to 0. 5%, then the flexural strength increases from 31.6 MPa to 57.2 MPa (by 81%). If the proportion of the additive is 1%, the flexural strength increases from 31.6 MPa to 60.6 MPa (by 92%). Under the same conditions, by increasing the amorphous of silica additives from 0% to 0.5% and the tensile strength perpendicularly to plate is increases from 0.99 MPa to 1.33 MPa (by 34%). If the proportion of the additive is 1%, then the strength is increased from 0.99 MPa to 1.42 MPa (by 43%). So, the value of the technically efficient and economically feasible proportion of the additive: from 0.50% to 0.70% relative to the weight of the resin. It is important, if the normal manufacturing technology chipboard them provides sufficient strength, then the use of a modifier in the form of amorphous silicon dioxide will provide the same strength under reduced share of binder. This will reduce the toxicity of these plates.

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